Solder paste not releasing properly from your stencil? Looking for a way to increase yields during PCB assembly? Nanocoatings are the solution. Use them on stencils to improve transfer efficiency, minimize insufficient solder paste deposits and other defects, and enhance your cleaning process.
MicroGlide is a SAMP (self-assembled monolayers phosphonate) stencil coating that comes packaged in a two-part, single-use wipe. This stencil treatment technology improves print quality, repels flux, enhances printing with small apertures, increases overall efficiency, and lowers your total costs. The product uniformly coats the entire surface and aperture walls, and aperture sizing does not need to be adjusted.
MicroGlide Platinum is the most advanced and most durable Nanocoating on the market today. An extremely thin layer of nanomaterial is heat-fused onto the stencil surface at very high temperatures. MicroGlide Platinum is an extremely durable stencil coating technology that improves print quality, enhances printing with small apertures, increases efficiency, and helps lower your total costs.